Encyclopaedia Index



  1. Compact modelling examples.
  2. System level analysis for electronics enclosures and their contents.
  3. Printed Circuit Boards analysis for thermal behaviour within PCB and its interaction within the colling air.
  4. Packaging level analysis of electronic components with internal structure and with attached heat sinks and interaction with cooling air.
  5. Component level: performance analysis of the single component models.
  6. Environment level analysis of surrounding effects on thermal performance.
  7. Efficient cooling techniques for high power dissipation units.

1. Compact modelling examples

3. System level analysis

3. PCB level analysis

4. Packaging level analysis

5. Component level analysis

6. Environment level analysis

7. Cooling techniques for high power dissipation units