BY : CHAM Development Team
DATE : 2023
FOR : Demonstration case
PHOENICS version: HOTBOX-2022
Details:
The heat sink is attached to the top of the package mounted on the north face of PCB cooled down by turbulent air flow.
The north package along with its neighbour at the PCB south face are modelled as planar heat sources.
Heat sink (spreader device) is represented as the porous domain fluid object with linear heat and quadratic momentum sources.
The heat sink and package attachments are simulated via anisotropic PCB: the across (through)-plane conductivity is set as 100 times larger than in-plane one.
Pictures are as follows :
