TITLE : Thermal interface under a PQFP.

DATE : 1999

FOR : Demonstration case

PHOENICS version: HOTBOX-99

DETAILS :

The conductive thermal interface layer is introduced underneath of heat-dissipation plastic object.

The purpose of the case is to find out how the temperature distribution is affected by the presence of an interface. The parametric studies can also be made to show how the interface conductivity would influence the temperature difference between the component and PCB.

Pictures are as follows :

• FQFP with interface on the PCB.
• Velocity vectors.
• Temperature distribution.