BY : CHAM Development Team
DATE : 2023
FOR : Demonstration case
PHOENICS version: HOTBOX-2022
Details:
In this case the cooling air from the fan flows over PCB/PQFP/heat sink assembly.
The composite multi-layer model is used to represent the the assembly structure and related thermal resistances.
Pin fin heat sink is represented as the porous domain fluid object with linear heat source.
Pictures are as follows :
